Fully Automatic Chemical Dosing Machine for Wafer Cutting          

Model: ELK-4000AS

1.1. This equipment is used for mixing, stirring, and dosing cutting fluid for dual-shaft wafer cutting machines;

1.2. The diaphragmless pump delivers the cutting fluid to the cutting machine at a certain ratio. The machine is designed with 4 dosing ports, capable of supplying cutting fluid to 4 cutting machines simultaneously.

1.3. The liquid level sensors detect the liquid levels in the dosing tank and circulating tank;

1.4. Automatic dosing is based on flow sensing or cutting machine command signals;

1.5. The cutting fluid stirring and dosing machine can simultaneously serve 4 dual-shaft dicing machines;

1.6. The body is made of environmentally friendly and corrosion-resistant white pure PP material, suitable for the semiconductor industry;

1.7. It has a water inlet pressure display function;

1.8. It has a low water pressure alarm and signal output function;

1.9. It has an infrared leakage alarm and signal output function;

1.10. Control: PLC with touch screen, data storage, and network interface;

1.11. There are three levels of management authority, each with password protection; engineering maintenance parameters have separate permission settings, and important parameters are encrypted;

1.12. It has a LOG viewing function to check machine operation records;

1.13. The machine contains 4 imported brand dosing pumps and one magnetic circulation pump, with pressure and flow meeting dosing requirements;

1.14. A flow switch monitors the pipeline flow between the CO2 foaming machine and the dual-shaft wafer cutting machines to ensure synchronized dosing during cutting operations;

1.15. PLC is used for signal action control, HMI is used for operating system control;